Trial preparation of printed circuit board
碩士 === 中國文化大學 === 材料科學與製造研究所 === 91 === Printed circuit board (PCB) is a mainstay of electronic industry. It is often made of laminated sheets, mostly copper clad laminate (CCL) which is composed of base paper, resin and copper foils. Aramid fiber has excellent properties such as low density, high t...
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ndltd-TW-091PCCU01590212015-10-13T13:35:28Z http://ndltd.ncl.edu.tw/handle/63939685447882170605 Trial preparation of printed circuit board Kevlar纖維濕式抄造紙張之研究 Yang Yi-Feng 楊宜豐 碩士 中國文化大學 材料科學與製造研究所 91 Printed circuit board (PCB) is a mainstay of electronic industry. It is often made of laminated sheets, mostly copper clad laminate (CCL) which is composed of base paper, resin and copper foils. Aramid fiber has excellent properties such as low density, high tensile strength, high tensile modulus, low moisture content and few impure ions that affect electrical properties, in addition, these recycled aramid fibers have negative thermal expansion coefficient (TEC). Four kinds of base paper were made under different formula conditions, and three different quantities contained dispersing agents were added into paper. By the comparison, such as tensile strength, bursting strength, porosity and paper smoothness, we try to find the ratio of dispersing agents suitable for Kevlar. Then, three kinds of base paper were made under different formula conditions by Vinylon and Kevlar. A series of studies of the physical properties of base sheets, such as tensile strength, bursting strength, porosity and paper smoothness, were experimentally tested and effect factor and performance of the assembled Printed circuit board were discussed. As the result, it was found that the pulp formula of Vinylon:Kevlar=95:5 and NBKP:Kevlar=30:70, 2.0%dispersing agents was added into paper, which have better physical properties than the others. Lee Huang-Kwei 李璜桂 2003 學位論文 ; thesis 64 zh-TW |
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碩士 === 中國文化大學 === 材料科學與製造研究所 === 91 === Printed circuit board (PCB) is a mainstay of electronic industry. It is often made of laminated sheets, mostly copper clad laminate (CCL) which is composed of base paper, resin and copper foils. Aramid fiber has excellent properties such as low density, high tensile strength, high tensile modulus, low moisture content and few impure ions that affect electrical properties, in addition, these recycled aramid fibers have negative thermal expansion coefficient (TEC).
Four kinds of base paper were made under different formula conditions, and three different quantities contained dispersing agents were added into paper. By the comparison, such as tensile strength, bursting strength, porosity and paper smoothness, we try to find the ratio of dispersing agents suitable for Kevlar. Then, three kinds of base paper were made under different formula conditions by Vinylon and Kevlar. A series of studies of the physical properties of base sheets, such as tensile strength, bursting strength, porosity and paper smoothness, were experimentally tested and effect factor and performance of the assembled Printed circuit board were discussed.
As the result, it was found that the pulp formula of Vinylon:Kevlar=95:5 and NBKP:Kevlar=30:70, 2.0%dispersing agents was added into paper, which have better physical properties than the others.
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author2 |
Lee Huang-Kwei |
author_facet |
Lee Huang-Kwei Yang Yi-Feng 楊宜豐 |
author |
Yang Yi-Feng 楊宜豐 |
spellingShingle |
Yang Yi-Feng 楊宜豐 Trial preparation of printed circuit board |
author_sort |
Yang Yi-Feng |
title |
Trial preparation of printed circuit board |
title_short |
Trial preparation of printed circuit board |
title_full |
Trial preparation of printed circuit board |
title_fullStr |
Trial preparation of printed circuit board |
title_full_unstemmed |
Trial preparation of printed circuit board |
title_sort |
trial preparation of printed circuit board |
publishDate |
2003 |
url |
http://ndltd.ncl.edu.tw/handle/63939685447882170605 |
work_keys_str_mv |
AT yangyifeng trialpreparationofprintedcircuitboard AT yángyífēng trialpreparationofprintedcircuitboard AT yangyifeng kevlarxiānwéishīshìchāozàozhǐzhāngzhīyánjiū AT yángyífēng kevlarxiānwéishīshìchāozàozhǐzhāngzhīyánjiū |
_version_ |
1717737318280855552 |