A Study on Fracture Characterists of Eutectic Sn-based Alloys under High Electrical Current
碩士 === 國立成功大學 === 材料科學及工程學系碩博士班 === 92 === The miniaturization of electronic product is a trend of nowadays. Consequently, the size of solder joint will reduce and thus the current density will become higher. This study aimed to investigate the properties and reliability of binary eutectic tin-ba...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/63955986507551731056 |