Study on Electrical Properties of Cu Interconnect after Post CMP Cleaning
碩士 === 國立交通大學 === 電子工程系所 === 92 === Although Cu CMP has being the enabling technology for multilevel Cu interconnect manufacturing, there were several challenges to its implementation. One of the serious challenges was post-Cu CMP cleaning. There will be a large amount of contaminants on the wafers...
| Main Authors: | , |
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| Format: | Others |
| Language: | en_US |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/u6789j |