Controlling Pollutant Dispersion during Preventative Maintenance of a Metal Etcher in a Semiconductor Factory
碩士 === 國立交通大學 === 工學院碩士在職專班產業安全與防災學程 === 92 === The main gases in metal etching are hydrogen trichloride and boron chloride in semiconductor manufacturing processes. The process gases are ionized to form free radicals by plasma, which etch off aluminum film of the wafer surface. To increase produc...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23814194258860706269 |