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碩士 === 國立中央大學 === 機械工程研究所 === 92 === In this study, elelctrochemical polishing of Cu-coated silicon wafer was explored. Anodic cyclic voltammograms was used to compare with various electrochemical polishing conditions. For example: kind of solution(add a oxidizing、contaminating agent or a diff...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/18811097456917576865 |