Temperature Cycling Loading/ Thermo-Mechanical Behaviors on Lead-Free Solder Joints of Wafer Level Chip Scale Packages

• Main Authors: Hsiu-Tao Chang, 張秀桃
• Other Authors: Wen-Ren Jong
• Format: Others
• Language: zh-TW
• Published: 2005
• Online Access: http://ndltd.ncl.edu.tw/handle/52675464171556697810

碩士 === 中原大學 === 機械工程研究所 === 93 === The miniaturized and unleaded packages in IC manufacturing made a tremendous impact. Each material of solder joints used to IC packages has various supporters, but it cannot be incorporated and integrated identically at present. The finite element simulation with 2D model is hard to simplify in reliability analysis. First, this study investigates different models with 2D and 3D. In accordance with the result, it adopts one-eighth model to analyze with the finite element software and Taguchi method. The orthogonal array of is utilized to probed the effects and behaviors of strain under five temperature loading parameters of temperature ramp rate, high and low dwell temperature, and dwell temperature time. Furthermore, the study investigates thermal mechanical behavior of the four solder joint materials under four temperature loading. The result shows that 2D model differs from 3D model in one order. This study selects one-eighth model in all kinds of 3D model to estimate the reliability. In the serious study, the temperature range is the main factor to the magnitude of the strain range from the Taguchi experiment. Second, it can be found that the temperature range is the most significant factor on elastic-plastic-creep analysis under four temperature loadings, and the temperature ramp rate affects slightly. This result is the same as the Taguchi experiment. The purpose in serious study is to provide more information of the thermal mechanical behavior of lead-free solder toward the standard parameter of thermal cycling test in the future.