Temperature Cycling Loading/ Thermo-Mechanical Behaviors on Lead-Free Solder Joints of Wafer Level Chip Scale Packages

碩士 === 中原大學 === 機械工程研究所 === 93 === The miniaturized and unleaded packages in IC manufacturing made a tremendous impact. Each material of solder joints used to IC packages has various supporters, but it cannot be incorporated and integrated identically at present. The finite element simulation with 2...

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Bibliographic Details
Main Authors: Hsiu-Tao Chang, 張秀桃
Other Authors: Wen-Ren Jong
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/52675464171556697810