Temperature Cycling Loading/ Thermo-Mechanical Behaviors on Lead-Free Solder Joints of Wafer Level Chip Scale Packages
碩士 === 中原大學 === 機械工程研究所 === 93 === The miniaturized and unleaded packages in IC manufacturing made a tremendous impact. Each material of solder joints used to IC packages has various supporters, but it cannot be incorporated and integrated identically at present. The finite element simulation with 2...
| Main Authors: | , |
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/52675464171556697810 |