Research for Wire Sweep on IC Package Using Taguchi Methods
碩士 === 中原大學 === 機械工程研究所 === 93 === The development trend of IC is high speed, good electronic performance, and high I/O interconnection. As thinner and denser IC packages coming, wire sweep has become one of the major defects in the encapsulation of microelectronic chips by the transfer molding proc...
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| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56157634023880275710 |
| Summary: | 碩士 === 中原大學 === 機械工程研究所 === 93 === The development trend of IC is high speed, good electronic performance, and high I/O interconnection. As thinner and denser IC packages coming, wire sweep has become one of the major defects in the encapsulation of microelectronic chips by the transfer molding process. So wire-sweep analysis becomes more challenging and troublesome.
This paper presents the study for the transfer molding process of BGA 208L. It is according to the actual situation experience to select the main process parameter that influence the wire-sweep. And give some suitable process condition to package, and then the x-ray is used to Measurement the wire-sweep of different process parameters. In addition, the Taguchi method is used to find optimal processing conditions to reduce the wire-sweep problems.
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