Research for Wire Sweep on IC Package Using Taguchi Methods
碩士 === 中原大學 === 機械工程研究所 === 93 === The development trend of IC is high speed, good electronic performance, and high I/O interconnection. As thinner and denser IC packages coming, wire sweep has become one of the major defects in the encapsulation of microelectronic chips by the transfer molding proc...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56157634023880275710 |