The Synthetic Technology of Nano Organic Abrasive with High Efficiency in CMP
碩士 === 逢甲大學 === 化學工程學所 === 93 === The progressively decreasing feature size increases the need for global surface planarization of the various thin film layers that constitute the integrated circuit (IC). Chemical Mechanical Polishing (CMP) is the only method achieveing the global planarization requ...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/73180790587538258587 |