The Use of Taguchi Method to Optimize Lead Free Soldering Process
碩士 === 華梵大學 === 工業工程與經營資訊學系碩士班 === 93 === In the electronics packaging, Surface Mount Technology (SMT) helps achieve miniaturation of end product and lower production cost. However, starting on July 1, 2006, electronic products containing lead ingredient will be prohibited. This will have a major im...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/99244971203187333801 |