Thermal Design and Reliability Analysis For System In Package(SIP) With Polymer Base Material
碩士 === 義守大學 === 材料科學與工程學系 === 93 === A system-in-package(SIP) is a system level which was designed as integrates multiple functional chips, memory chip and discrete components into a single package by way of assembly process. The benefits provided by this integration can reduce the development cost...
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| Format: | Others |
| Language: | zh-TW |
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/61296505110160939112 |