Reactivity Research of Hydrogen Peroxide and Copper Ions at Electrochemical Plating Process
碩士 === 崑山科技大學 === 環境工程研究所 === 93 === The usage of hydrogen peroxide and copper ions were increased with the mass production of the copper integration process for improving the devices performance in semiconductor industry. The compatibility of hydrogen peroxide and copper ions at electrochemical pla...
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| Format: | Others |
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2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/31890527877610112312 |