The Business Opportunity of Wafer-Level Chip-Scale Packaging Technologies for Image Sensor - Case Study on Xintec Technology Company
碩士 === 國立交通大學 === 管理學院碩士在職專班科技管理組 === 93 === CMOS Iimage Sensor (CIS) is rapidly becoming the technology of choice for digital imaging in mobile phones and other portable digital consumer products, as it offers advantages in size, power consumption and system cost. This thesis probes into the emergi...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2004
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| Online Access: | http://ndltd.ncl.edu.tw/handle/56066089754134727115 |