The dissolution rate of copper in the molten solder with current stressing
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 93 === The electromigration of solder at solid state was studied in the past, but it was not discussed at liquid state. In this study, we take the micro capillary to design a Cu/solder/Cu structure. We make the marker on the copper wire with the distance of 300 �慆...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2005
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| Online Access: | http://ndltd.ncl.edu.tw/handle/37233324838846256742 |