Fabrication of micrometer columns by micro-anode guided eletroplating

碩士 === 國立中央大學 === 機械工程研究所 === 93 === Abstract Micro-column with the composition of nickel-copper alloy was fabricated by micro anode guided electroplating (MAGE) method. There are two solutions were used (sulfate and citrate solution) for discussing the practicability of fabricating the micrometer N...

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Main Authors: Jia-Hong Jeng, 鄭家宏
Other Authors: Jing-Chie Lin
Format: Others
Language:zh-TW
Published: 2005
Online Access:http://ndltd.ncl.edu.tw/handle/64916830272593269033
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spelling ndltd-TW-093NCU054891432015-10-13T16:31:55Z http://ndltd.ncl.edu.tw/handle/64916830272593269033 Fabrication of micrometer columns by micro-anode guided eletroplating 以微陽極導引電鍍法製作鎳銅合金微柱 Jia-Hong Jeng 鄭家宏 碩士 國立中央大學 機械工程研究所 93 Abstract Micro-column with the composition of nickel-copper alloy was fabricated by micro anode guided electroplating (MAGE) method. There are two solutions were used (sulfate and citrate solution) for discussing the practicability of fabricating the micrometer Ni-Cu alloy column. In experiment, we change the bias between anode and cathode, the concentration of copper sulfate in solution, in order to discussing the variation of the proportion of nickel to copper and the surface morphology of micro Ni-Cu alloy column by SEM. In the citrate solution, we can fabricate a uniform micro Ni-Cu alloy column at the applied voltage was 4.2V and the gap between anode with cathode is 10μm. Changing the concentration of copper sulfate in solution is the most effect of the surface morphology and the structure of the micro-alloy column. As the concentration of copper sulfate in solution is 4mM, the surface morphology of micro Ni-Cu alloy column is more smoothly and the structure is more solidly. When the concentration of copper sulfate is increasing to 8mM, the deposits on the column surface is becoming to roughly deposit and the diameter of column uniformly. The proportion of nickel to copper is increasing from 75/25、80/20、83/17 to 87/23 with the in creasing of the applied voltage between the anode and cathode, but the proportion of nickel to copper is decreasing from 75/25、59/41 to 49/51 with the increasing of the concentration of copper sulfate in bath. We did fabricated the micro Ni-Cu alloy column and successfully make use of measuring temperature. Jing-Chie Lin 林景崎 2005 學位論文 ; thesis 151 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立中央大學 === 機械工程研究所 === 93 === Abstract Micro-column with the composition of nickel-copper alloy was fabricated by micro anode guided electroplating (MAGE) method. There are two solutions were used (sulfate and citrate solution) for discussing the practicability of fabricating the micrometer Ni-Cu alloy column. In experiment, we change the bias between anode and cathode, the concentration of copper sulfate in solution, in order to discussing the variation of the proportion of nickel to copper and the surface morphology of micro Ni-Cu alloy column by SEM. In the citrate solution, we can fabricate a uniform micro Ni-Cu alloy column at the applied voltage was 4.2V and the gap between anode with cathode is 10μm. Changing the concentration of copper sulfate in solution is the most effect of the surface morphology and the structure of the micro-alloy column. As the concentration of copper sulfate in solution is 4mM, the surface morphology of micro Ni-Cu alloy column is more smoothly and the structure is more solidly. When the concentration of copper sulfate is increasing to 8mM, the deposits on the column surface is becoming to roughly deposit and the diameter of column uniformly. The proportion of nickel to copper is increasing from 75/25、80/20、83/17 to 87/23 with the in creasing of the applied voltage between the anode and cathode, but the proportion of nickel to copper is decreasing from 75/25、59/41 to 49/51 with the increasing of the concentration of copper sulfate in bath. We did fabricated the micro Ni-Cu alloy column and successfully make use of measuring temperature.
author2 Jing-Chie Lin
author_facet Jing-Chie Lin
Jia-Hong Jeng
鄭家宏
author Jia-Hong Jeng
鄭家宏
spellingShingle Jia-Hong Jeng
鄭家宏
Fabrication of micrometer columns by micro-anode guided eletroplating
author_sort Jia-Hong Jeng
title Fabrication of micrometer columns by micro-anode guided eletroplating
title_short Fabrication of micrometer columns by micro-anode guided eletroplating
title_full Fabrication of micrometer columns by micro-anode guided eletroplating
title_fullStr Fabrication of micrometer columns by micro-anode guided eletroplating
title_full_unstemmed Fabrication of micrometer columns by micro-anode guided eletroplating
title_sort fabrication of micrometer columns by micro-anode guided eletroplating
publishDate 2005
url http://ndltd.ncl.edu.tw/handle/64916830272593269033
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