| Summary: | 碩士 === 國立臺灣大學 === 機械工程學研究所 === 93 === With the computer function continuously enhanced, the frequency of CPU, VGA chips and the other chips set are also raised. However, the hot condition becomes more rigorous because the design of machine hull is more agile than past to follow the convenience and trend. The main purpose of this research is to adopt the Icepak to carry on the simulation and the analysis to the heat pipe-fin modules. The target is to reach the ideal CPU temperature. First, we have an experiment to identify the accuracy of Icepak. The temperature’s maximum error between CPU of simulation and the experiment is 2.78% and the maximum error margin of thermal resistance is about 2.71%. The trend of simulation is consistent with the result of the experiment, which proofs Icepak in the accuracy of the thermal analysis.
According to the analysis of the result, it shows that when considering the vertical interval in heat pipe condenser section is 61.32mm, the thermal performance is better. Besides, as the heat pipe condenser section is 26mm, its thermal performance is better to the others. As for the evaporator section, while the interval in evaporator section is 8mm, the better the thermal performance. Increasing the number of heat pipes also can reduce the temperature of CPU and the thermal resistance. Compared with Type B module, its total thermal resistance can at least reduce about 10.69%.
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