Adaptive EWMA Control for Chemical Mechanical Polishing Process

碩士 === 長庚大學 === 化工與材料工程研究所 === 94 === As we know, chemical mechanism polishing (CMP) process takes a big weight in semiconductor industrial process. For the CMP process control, run-to-run (RtR) control is known as a suitable method which can always adjust the process recipe. EWMA (Exponentially Wei...

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Bibliographic Details
Main Authors: CHEN,SHR-RUNG, 陳士榮
Other Authors: Wang,Gow-Bin
Format: Others
Language:zh-TW
Published: 2006
Online Access:http://ndltd.ncl.edu.tw/handle/81552953007845111556