Surfactants on the surface of copper wafer for wetting behavior research
碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 94 === In this paper, we can know that the semiconductor production process, especially the Post CMP process is very important. The Post CMP cleaning can let to know how to research the phenomena of copper surface. We present our method for the measurement of conta...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/wu32b3 |