四方平面無腳封裝體之最佳切削參數研究
碩士 === 國立彰化師範大學 === 機電工程學系 === 94 === The main purpose of this thesis is first to investigate the wearing phenomena of thin diamond blades when the blade is applied on sawing QFN (quad flat no lead) assemble package. Based on the results obtained in Part I, in the second part of this study, the wear...
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| Format: | Others |
| Language: | zh-TW |
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2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/94331704983298758059 |