A study of Si-based ICs for chip-to-chip optical interconnect

• Main Authors: YUAN-PYNG ,LEE, 李源評
• Other Authors: Cheng-Kuang Liu
• Format: Others
• Language: zh-TW
• Published: 2006
• Online Access: http://ndltd.ncl.edu.tw/handle/9htw2j

碩士 === 國立臺灣科技大學 === 電子工程系 === 94 === In this thesis, a study of integration circuits for chip-to-chip optical interconnect is presented. CMOS process provided by CIC (Chip Implement Center) is used. Here, we study three topics: the silicon light emission, the silicon photodiode, the transimpedance and limiting amplifiers. The first part deals with the CMOS silicon light-emitting chip. Finger structures are used to study the efficiency of light emission. Silicon light emission chips of pn junctions are designed. The maximum quantum external efficiency obtained is 3.7×10-6 with an area of 200×300 µm2. The second part is about the silicon photodiode chip, The PNNP type has a maximum responsivity R=0.3(A/W) and a quantum efficiency =0.26. The last topic is about the the transimpedance amplifier and limiting amplifier .Our transimpedance amplifier has 93.6dBΩ transimpedance and 38MHz bandwidth.Our limiting amplifier has 26.8dB gain and 16.63MHz bandwidth, Finally, the last measurement result of chip-to-chip interconnect is presented In the topics mentioned above, they have the same feature in the use of material, and it can be applied to the opto-electronic interconnect among integrated circuit chips.