Effect for 2-mercaptobenzothiazole and Potassium iodide on Electroless Copper Deposition
碩士 === 國立臺北科技大學 === 化學工程所 === 94 === Copper is replacing aluminum as the advanced ULSI interconnect material because of its lower resistivity and better electromigration performance. Currently in the ULSI industry, copper is deposited by electroplating. But an adhesion/barrier layer and high-quality...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2006
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| Online Access: | http://ndltd.ncl.edu.tw/handle/d58zad |