Characteristic Analysis of Polishing System for Low Stress CMP Process

碩士 === 國立中正大學 === 機械工程所 === 95 === As the speed requirement of electronic devices becomeaq higher and higher, signal transmission delay time must be reduced to meet the requirement. However, the speed is limited by the transmission line with a RC time constant. Utilizing the materials such as copper...

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Bibliographic Details
Main Authors: Huang-chi Cheng, 鄭煌基
Other Authors: Meng-Shiun Tsai
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/00249900843223668900