Using a microtensile system to measure the mechanical properties of micro Sn and Cu-Sn intermetallics thin film materials
碩士 === 中興大學 === 精密工程學系所 === 95 === Solder joints play an important role for all devices in microelectronic package.In this research,we investigated mechanical properties of pure Sn thin film in micron scale and designed many kinds of micro fabrication processes along with microelectroplate to fabric...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/38250048138826888206 |