Slurry Flow Calculation and Process Parameter Optimization for Chemical Mechanical Planarization
碩士 === 國立成功大學 === 機械工程學系碩博士班 === 95 === Chemical mechanical planarization (CMP) has played an enabling role in producing near-perfect planarity of interconnection and metal layers in ultralarge-scale integrated (ULSI) devices. For stable and high performance of CMP, it is important to ensure unifor...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/08748690092155594796 |