Study on IMC Analysis and Bondability in Assembly Process
碩士 === 國立中山大學 === 電機工程學系研究所 === 95 === Recently, wirebonding process play an important role in IC assembly packaging manufacture. No degradation of bonding wire interconnection and defect free eutectic alloy bonding offer the high yield and reliability of products. The degradation of Au wire/Al bond...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/d93rzv |