Reliability Analysis of Plate Carrying a Distributed Mass Due to Drop Impacts -Application to Electronic Products

碩士 === 國立臺灣科技大學 === 機械工程系 === 95 === The main purpose of this is to study the dynamic response and the reliability of electronic products experienced a drop impact. The products in question are packaged in a system including a plate element, a chassis and a cabinet. In the analysis the plate element...

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Bibliographic Details
Main Authors: bo-jen Wang, 王柏仁
Other Authors: Sen-Lin Lu
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/4z5w2p