The vibration analysis of the high speed pick and place for the semiconductor chip bounding process
碩士 === 國立虎尾科技大學 === 光電與材料科技研究所 === 95 === This research uses the CAD&CAE software “CATIA”, to design and analyze the high speed pick and place module applied in LED packaging process. Follow the industrial specification, construct and optimize the model by mathematical method. Then using the s...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/j7t4e9 |