Investigation of Two-Phase Loop Thermosyphon Cooling System for Electronics

碩士 === 國立雲林科技大學 === 機械工程系碩士班 === 95 === ABSTRACT Traditional cooling scheme, Fan-Heat Pipe thermal module, can not resolve the thermal problem for high performance CPU with heat dissipated 150W or 23W/cm2. Hence, the new cooling technique is needed. Liquid cooling seems to be the solution due to its...

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Bibliographic Details
Main Authors: Chia-Hsing Chien, 簡嘉興
Other Authors: Li-Chieh Hsu
Format: Others
Language:zh-TW
Published: 2007
Online Access:http://ndltd.ncl.edu.tw/handle/68048146006161188805