The Effects of Pressure, Moisture, and Temperature on the Reliability of High-Power LED Packages
碩士 === 長庚大學 === 機械工程研究所 === 96 === The purpose of this study is to evaluate the effects of pressure, moisture and temperature on the reliability of the high-power COP (Chip on Plate) LED packages, by testing their packages and modules through three different standard tests: pressure cooker test (PCT...
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| Format: | Others |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/23311458225308610276 |