The effect of substrate mechanical properties on warpage of fcbga packages
碩士 === 長庚大學 === 機械工程研究所 === 96 === ABSTRACT The coplanarity of flip-chip BGA packages is one of important issues related to the package assembly and solder ball reliability, especially during lead-free solder reflow temperature (about 260 ). The aim of this study is to measure and simulate warpage o...
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| Format: | Others |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76305346550566850097 |