Reliability Analysis and Transient Drop Impact Analysis for System-in-Package(SIP)
碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 96 === The objective of this research is focused on the dynamic impact response on drop test using support excitation scheme for the package of System in Package (SiP). SiP is a system level which was designed as integration of multiple functional chips, memory chi...
Main Authors: | , |
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Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2008
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Online Access: | http://ndltd.ncl.edu.tw/handle/65330110741089203113 |