Reliability Analysis and Transient Drop Impact Analysis for System-in-Package(SIP)

Reliability Analysis and Transient Drop Impact Analysis for System-in-Package(SIP)

碩士 === 義守大學 === 機械與自動化工程學系碩士班 === 96 === The objective of this research is focused on the dynamic impact response on drop test using support excitation scheme for the package of System in Package (SiP). SiP is a system level which was designed as integration of multiple functional chips, memory chi...

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Bibliographic Details
Main Authors:	Kung-hao Wang, 王功豪
Other Authors:	Hsiang-Chen Hsu
Format:	Others
Language:	zh-TW
Published:	2008
Online Access:	http://ndltd.ncl.edu.tw/handle/65330110741089203113

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