Warpage and stress analysis of LFBGA type package
碩士 === 國立高雄應用科技大學 === 工業工程與管理系碩士班 === 96 === Abstract The developing of electronic devices are toward lighter, thinner, shorter, and smaller, the IC packages follow the same trend. The thickness of low-Profile type packages is thinner. So the stiffness of thin type packages are weaker, the die s...
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| Format: | Others |
| Language: | zh-TW |
| Published: |
2007
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| Online Access: | http://ndltd.ncl.edu.tw/handle/25768059958438453737 |