The Image Inspection Method of Solder Joints on Printed Circuit Boards
碩士 === 明新科技大學 === 電子工程研究所 === 96 === Nowadays, the device under test (DUT) is still tested by manual in Taiwan’s high technology companies. The quality of DUT is not increased with human resource and cost. So, in this study, a system to detect and analyze the devices soldered on the printed circuit...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/05564082623078863970 |