The Image Inspection Method of Solder Joints on Printed Circuit Boards
碩士 === 明新科技大學 === 電子工程研究所 === 96 === Nowadays, the device under test (DUT) is still tested by manual in Taiwan’s high technology companies. The quality of DUT is not increased with human resource and cost. So, in this study, a system to detect and analyze the devices soldered on the printed circuit...
Main Authors: | Jo Yang Wang, 王若揚 |
---|---|
Other Authors: | Ming Feng Lu |
Format: | Others |
Language: | zh-TW |
Published: |
2008
|
Online Access: | http://ndltd.ncl.edu.tw/handle/05564082623078863970 |
Similar Items
-
Image Processing for Automatic Inspection of Printed Circuit Boards
by: Po-chin Yang, et al.
Published: (2005) -
Using image analysis in printed circuit board inspection
by: 何義才
Published: (2001) -
Research on Printing Defects Inspection of Solder Paste Images
by: Cheng, G., et al.
Published: (2022) -
The Application of Image Processing Technique to the Inspection of Printed Circuit Board
by: Shih-Yuan Huang, et al.
Published: (2005) -
Non-soldering contact connections for electronic printed circuit boards
by: Sobchenko D. L., et al.
Published: (2009-06-01)