Development of a novel leveler and its application on copper electroplating for via and through hole filling
碩士 === 國立中興大學 === 化學工程學系所 === 96 === In order to enhance the functions of electronic products and let their size become smaller, the manufacture teachnologies of chips and printed circuit boards (PCBs) have to be changed. For example, the Dual Damascus Process has been used in chip manufacture to re...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Online Access: | http://ndltd.ncl.edu.tw/handle/35759853878559469222 |