Brightener analysis by means of Self-Assembled-Monolayer concept used for Copper Electroplating

碩士 === 國立中興大學 === 化學工程學系所 === 96 === Recently, electronic products tend toward light, thin, short and multi-functional. The distance among integrated circuit devices shrinks progressively and the speed of signal transmission is correspondingly fast, so high density pattern must be designed to meet t...

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Bibliographic Details
Main Authors: Yong-Da Chiu, 邱詠達
Other Authors: 竇維平
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/08101676942402928996