Effects of SMD Package Substrates on Performance of Ultraviolet Light-Emitting Diodes
碩士 === 國立中興大學 === 精密工程學系所 === 96 === This dissertation describes the effects of packaging substrates on the performance of surface-mount ultraviolet (UV) InGaN light-emitting diodes (LEDs). By taking the heat transfer theory and material verification result into account, the optimization of the pack...
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| Format: | Others |
| Language: | zh-TW |
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2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/60171158432119606692 |
| Summary: | 碩士 === 國立中興大學 === 精密工程學系所 === 96 === This dissertation describes the effects of packaging substrates on the performance of surface-mount ultraviolet (UV) InGaN light-emitting diodes (LEDs). By taking the heat transfer theory and material verification result into account, the optimization of the packaging materials for UV LEDs has been performed. We have selected the 380-nm UV LED chips for these experiments. Various packaging types have been attempted and show different optoelectronic characteristics after device measurements. There are two kinds of plastic with leaded chip carriers (PLCC), low-temperature co-fired ceramic (LTCC) substrate and high-temperature co-fired ceramic (HTCC) substrate. Experimental results show that the light extraction efficiency of HTCC UV LED can be improved up to 44%, and that of the PLCC sample is degraded down to 33.5%. Under a 20-mA current injection, the HTCC UV LED shows a junction temperature of 30.5
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