The optimum combination for Printed Circuit Board without halogen free prepreg lamination process

• Main Authors: Chin-Hsiang Wang, 王錦祥
• Other Authors: none
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/32620791908500642802

碩士 === 國立中央大學 === 化學工程與材料工程研究所 === 96 === This research is to conduct the experiment by using Takuchi Methods. The Singnal to Noise Ratios is also used to figure out the optimum combination for Printed Circuit Board without halogen free prepreg lamination process, which can facilitate to reach the required quality target. This experiment adopted L9(34) orthogonal array. We selected the lamination time, lamination temperature, lamination process and heat rate as the control factors.3 degree levels have been set for each factor to each the quality target of peeling strength；delta glass transition temperature (△Tg) and coefficient of thermal expansion (CTE) are valuation target which is selected as the best effect control factor. The result experiment shows that the delta glass transition temperature (△Tg) is 4.42℃ and the high temperature coefficient of thermal (α2) is 294.40 μm/(m．℃) when selected lamination time is 60min, lamination temperature is 190℃, lamination pressure is 250psi and heat rate is 1.2℃/min. Besides, the best effect control factor is lamination temperature.