Defect behaviors of electroplated copper films during chemical mechanical polishing
博士 === 國立清華大學 === 化學工程學系 === 96 === Knowledge of the defect behaviors of copper-interconnect surface is important for continuous yield improvement. This study is to focus on the defect behavior in copper damascene process, aiming at, (a) pits-formation mechanism related to structure and impurities o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/84998689851426272828 |