The Investigation of Thermal Characterization by the Effect of Power Cycle on the Package Chip
碩士 === 北台灣科學技術學院 === 機電整合研究所 === 97 === In the first part of this research, a measurement fixture which can make measurements on the thermal test chip with both RTD and diode thermal sensors simultaneously was developed. The corresponding strategy of the RTD and diode thermal sensors was also discus...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/05201721296403510432 |
| Summary: | 碩士 === 北台灣科學技術學院 === 機電整合研究所 === 97 === In the first part of this research, a measurement fixture which can make measurements on the thermal test chip with both RTD and diode thermal sensors simultaneously was developed. The corresponding strategy of the RTD and diode thermal sensors was also discussed. The relationship of temperature and power inside a chip at steady-state was further investigated.
In the second part of the research, a thermal chip vehicle with the capability of constant power as well as power cycle generation was developed. The power control on the heaters inside the thermal test die was accomplished by the PWM method. Several case studied were also conducted to discuss the thermal characterizations of the thermal test chip with different heatsink and thermal interface materials (TIMs) under power cycle conditions.
In the last part, the power cycle experiments were made by a real electric system. The power cycle was emulated by controlling the frequency and period of cycling power cycle. Several selected points and die temperature were measured and recorded under the power cycle running. A further analysis was also conduced. Furthermore, the power control of the thermal test die was made to emulate the real system running condition. The power was correlated with the measurement data obtained by the real system power cycle experiments.
|
|---|