Effect of Tensile-stress on MOS Capacitors with Rapid Thermal Ultra-Thin Gate Oxides

碩士 === 國立臺灣大學 === 電子工程學研究所 === 96 === As MOS devices are scaled down to achieve high performance, the thicknesses of silicon dioxides are also scaled down. Besides, the growth temperature of thermal ultra-thin oxides is reduced to obtain better control. This trend results in gate leakage current inc...

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Bibliographic Details
Main Authors: Chien-Yu Liu, 劉建語
Other Authors: Jenn-Gwo Hwu
Format: Others
Language:zh-TW
Published: 2008
Online Access:http://ndltd.ncl.edu.tw/handle/98024119639421053379