The Study of Interfacial Reactions betweenSn-9Zn Lead-Free Solder and Au/Ni/SUS304 Substrate

• Main Authors: Kuo-Sing Chao, 趙國興
• Other Authors: Yen Yee-Wen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/18773701313878883383

碩士 === 國立臺灣科技大學 === 材料科技研究所 === 96 === Lead-free solder as Sn-9Zn so cheap has attracted extensive studies recently. On the other hand, the interfacial reaction between the Sn-9Zn based solders and Au/Ni/SUS304 substrate were rarely studied before. This study investigated the interfacial reaction between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate. The liquid-solid reaction temperature at 240、255 and 270℃, reacted 1、2、3、4 and 5 hour. After reaction, we analyzed the species of IMCs and observed morphology of IMCs. The thickness of the reaction layers increased with higher temperature and longer reaction time. The growth of IMC formed at interface between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate was diffusion controlled(n=0.5), and their growth rates were described by using the parabolic law. EPMA results revealed, only a continuous Ni5Zn21 was found between Sn-9Zn lead-free solder and Au/Ni/SUS304 substrate. The IMCs content of others were not observed at all. The k values of Ni5Zn21 growth rate constant increased with higher temperature, and the activation energy of growth was 112.5 kJ/mol.