Dynamic Modeling of IC Package
碩士 === 雲林科技大學 === 環境與安全工程系碩士班 === 96 === Our prosper semiconductor industry has brought about active IC package production. Due to the dominating of Wire Bond (WB) number on the production and increasing competition, IC package industry needs to elevate its process control by studying the effects o...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2008
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| Online Access: | http://ndltd.ncl.edu.tw/handle/49935929344222137246 |