Status and Trend Analysis of the Packaging Industry and the Solutions: A Case Study of the T Company

• Main Authors: Hui-Kun Lin, 林暉焜
• Other Authors: Ja-Shen Chen
• Format: Others
• Language: zh-TW
• Published: 2008
• Online Access: http://ndltd.ncl.edu.tw/handle/15043083701705841481

碩士 === 元智大學 === 管理研究所 === 96 === With the rapid technical advance, Moore''s Law, the guiding principle that has driven the digital revolution, predicts that the integrated density of integrated circuits will be doubled every 18-24 months. The high integrated density facilitates the downsizing of circuit components as well as packaging technologies. A research is conducted to evaluate the current packaging industry and the packaging trends in future development. In addition to the problems with competitors, the cost reduction and new product development are two major challenges for the packaging industry. To shorten the product cycle times, it is important for companies to find ways to fast react to customers’ needs, reduce costs, and establish the core technology, and finally establish the business goal by differentiating the key competence from others. With the listed company, Tong Hsing Electronic Industries, as the research target, the aim of this study is to provide a thorough investigation on the internal and external environment including competitors analysis, the existing business operations of the case company, and provide solutions for ensuring competitive advantage. Implications for theory and practice are offered.