Three-Dimensional Power Distribution Network Design at Post-Floorplan Stage

碩士 === 中原大學 === 電子工程研究所 === 97 === Three-dimensional integrated circuits (3D ICs) offer significant improvements over two-dimensional circuits, and promise a solution to the severe problems to develop next generation design flow of 3D ICs (Three-Dimensional Integrated Circuits), this thesis collabor...

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Bibliographic Details
Main Authors: Yalamandala Raghu, 羅亞曼
Other Authors: Shih-Hsu Huang
Format: Others
Language:en_US
Published: 2009
Online Access:http://ndltd.ncl.edu.tw/handle/47350903657529499747