A review of wafer fab scheduling approaches-dispatching policies

• Main Authors: Ming-Chun Wu, 吳明峻
• Other Authors: Tin-Chih Chen
• Format: Others
• Language: zh-TW
• Published: 2009
• Online Access: http://ndltd.ncl.edu.tw/handle/32400689815867674590

碩士 === 逢甲大學 === 工業工程與系統管理學研究所 === 97 === Job scheduling is critical to the production control of a manufacturing system. A wafer fabrication factory is a very complicated manufacturing system with characteristics such as: fluctuating demand, jobs with various product types and priorities, un-balanced capacity, reentry of jobs into machines, alternative machines with unequal capacity, and shifting bottlenecks that make job scheduling jobs scheduling in a wafer fabrication a very difficult task. Many studies have shown that applying the general scheduling rules(such as first-in first out (FIFO), earliest due date (EDD), least slack (LS), shortest processing time (SPT), shortest remaining processing time (SRPT), critical ratio (CR) FIFO+, SRPT+, and SRPT++) to a semiconductor manufacturing factory did not lead to very satisfactory results. Nevertheless, the research focusing on scheduling a semiconductor manufacturing factory has become a very important issue at present. A review on the state-of-the-art scheduling approaches for wafer fabrication factory control is presented in this study.