On the Steady of Mechanical and Optimum Design for Ultra-Thin-Chip-on-Flex (UTCOF) with Anisotropic Conductive Adhesive (ACA) Joints
碩士 === 逢甲大學 === 航太與系統工程所 === 97 === Nowadays, portable electronic devices are being pushed toward the miniaturization and flexibility. The Ultra Thin Chip on Flex (UTCOF) technology is a very promising and feasible packaging solution for attaining the goals due to its high flexibility, and more impo...
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| Format: | Others |
| Language: | zh-TW |
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2009
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| Online Access: | http://ndltd.ncl.edu.tw/handle/13727678995558647166 |